Chip Packaging Part 6 - Wafer to Panel Level Packaging
electronicdesign.com
Chip Packaging Part 6 - Wafer to Panel Level Packaging
Dr. Navid Asadi’s group delves into wafer scale and panel level chip packaging.
Feb 4, 2021
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Bigger panels. Smarter packaging. Panel-level packaging takes chipmaking to the next level by fitting more chips onto large-format substrates, helping cut costs and boost output. Explore how our Kallisto product family brings this technology to life. https://bit.ly/4mCRx3S | Lam Research Corporation
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Bigger panels. Smarter packaging. Panel-level packaging takes chipmaking to the next level by fitting more chips onto large-format substrates, helping cut costs and boost output. Explore how our Kallisto product family brings this technology to life. https://bit.ly/4mCRx3S | Lam Research Corporation
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