The company is also looking to integrate Powertech's FOPLP advanced packaging technology into the Zen 7 architecture, along ...

Advanced Micro Devices Inc (AMD) yesterday said it is investing US$10 billion in the Taiwanese microchip ecosystem to ensure the availability of advanced packaging technology capacity over the next ...

According to a report from Taiwan's Commercial Times, AMD is considering TSMC's A14 process node for its Zen 7 generation.

AMD’s future Zen 7 processors could use TSMC’s A14 node, setting up a fresh CPU rivalry with Intel’s own 14A plans.The Latest Tech News, Delivered to Your Inbox ...

AMD's next-generation Zen 6 chips are launching later this year, although they're only coming to servers, most likely; gamers and other consumers will probably have to wait until next year. The ...

AMD has committed more than $10 billion to Taiwan’s semiconductor ecosystem, targeting advanced packaging and manufacturing capacity as demand for artificial intelligence infrastructure intensifies ...

Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response ...

TOKYO, May 21, 2026--(BUSINESS WIRE)--Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support ...

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TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to widen its lead ...